MSCDC50X1701AG Microchip Technology
Hersteller: Microchip TechnologyDescription: PM-DIODE-SIC-SBD-SP1F
Packaging: Tube
Package / Case: Module
Mounting Type: Chassis Mount
Diode Type: Three Phase
Operating Temperature: -40°C ~ 175°C (TJ)
Technology: Silicon Carbide Schottky
Voltage - Peak Reverse (Max): 1.7 kV
Current - Average Rectified (Io): 50 A
Voltage - Forward (Vf) (Max) @ If: 1.8 V @ 50 A
Current - Reverse Leakage @ Vr: 200 µA @ 1700 V
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 453.43 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details MSCDC50X1701AG Microchip Technology
Category: Three phase diode bridge rectifiers, Description: Bridge rectifier: three-phase; Urmax: 1.7kV; 50A; Press-in PCB, Version: module, Leads: Ø1,3±0,1mm, Electrical mounting: Press-in PCB, Features of semiconductor devices: Schottky, Mechanical mounting: screw, Technology: SiC, Type of bridge rectifier: three-phase, Case: SP1F, Max. forward voltage: 1.8V, Load current: 50A, Max. off-state voltage: 1.7kV.
Weitere Produktangebote MSCDC50X1701AG
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
|
MSCDC50X1701AG | Hersteller : Microchip Technology |
Diode Modules PM-DIODE-SIC-SBD-SP1F |
Produkt ist nicht verfügbar |
|
| MSCDC50X1701AG | Hersteller : MICROCHIP TECHNOLOGY |
Category: Three phase diode bridge rectifiersDescription: Bridge rectifier: three-phase; Urmax: 1.7kV; 50A; Press-in PCB Version: module Leads: Ø1,3±0,1mm Electrical mounting: Press-in PCB Features of semiconductor devices: Schottky Mechanical mounting: screw Technology: SiC Type of bridge rectifier: three-phase Case: SP1F Max. forward voltage: 1.8V Load current: 50A Max. off-state voltage: 1.7kV |
Produkt ist nicht verfügbar |
