MSCDC50X701AG Microchip Technology
Hersteller: Microchip TechnologyDescription: BRIDGE RECT 3PHASE 700V 50A
Packaging: Tube
Package / Case: Module
Mounting Type: Chassis Mount
Diode Type: Three Phase
Operating Temperature: -40°C ~ 175°C (TJ)
Technology: Silicon Carbide Schottky
Voltage - Peak Reverse (Max): 700 V
Current - Average Rectified (Io): 50 A
Voltage - Forward (Vf) (Max) @ If: 1.8 V @ 50 A
Current - Reverse Leakage @ Vr: 200 µA @ 700 V
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 129.78 EUR |
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Technische Details MSCDC50X701AG Microchip Technology
Category: Three phase diode bridge rectifiers, Description: Bridge rectifier: three-phase; Urmax: 700V; 50A; Press-in PCB, Load current: 50A, Max. off-state voltage: 700V, Version: module, Leads: Ø1,3±0,1mm, Electrical mounting: Press-in PCB, Features of semiconductor devices: Schottky, Mechanical mounting: screw, Technology: SiC, Case: SP1F, Type of bridge rectifier: three-phase, Max. forward voltage: 1.9V.
Weitere Produktangebote MSCDC50X701AG
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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MSCDC50X701AG | Hersteller : Microchip Technology |
Diode Modules PM-DIODE-SIC-SBD-SP1F |
Produkt ist nicht verfügbar |
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| MSCDC50X701AG | Hersteller : MICROCHIP TECHNOLOGY |
Category: Three phase diode bridge rectifiersDescription: Bridge rectifier: three-phase; Urmax: 700V; 50A; Press-in PCB Load current: 50A Max. off-state voltage: 700V Version: module Leads: Ø1,3±0,1mm Electrical mounting: Press-in PCB Features of semiconductor devices: Schottky Mechanical mounting: screw Technology: SiC Case: SP1F Type of bridge rectifier: three-phase Max. forward voltage: 1.9V |
Produkt ist nicht verfügbar |
