MSP430G2452CY Texas Instruments
Hersteller: Texas Instruments
Description: PROTOTYPE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MSP430™
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SPI, USI
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: Die
Part Status: Active
Description: PROTOTYPE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MSP430™
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SPI, USI
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: Die
Part Status: Active
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Technische Details MSP430G2452CY Texas Instruments
Description: PROTOTYPE, Packaging: Bulk, Package / Case: Die, Mounting Type: Surface Mount, Speed: 16MHz, Program Memory Size: 8KB (8K x 8), RAM Size: 256 x 8, Operating Temperature: -40°C ~ 85°C (TA), Oscillator Type: Internal, Program Memory Type: FLASH, Core Processor: MSP430™, Data Converters: A/D 8x10b, Core Size: 16-Bit, Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V, Connectivity: I²C, SPI, USI, Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT, Supplier Device Package: Die, Part Status: Active.