MSPM-20-19 Essentra Components
Hersteller: Essentra Components
Description: SUPT POST MICR .18"DIA FR 1 1/4"
Packaging: Bulk
Material: Nylon, Flame Retardant
Between Board Height: 1.250" (31.75mm) 1 1/4"
Holding Type: Snap Fit
Mounting Hole Diameter: 0.125" (3.18mm) 1/8"
Mounting Panel Thickness: 0.062" (1.57mm) 1/16"
Support Hole Diameter: 0.125" (3.18mm) 1/8"
Support Panel Thickness: 0.062" (1.57mm) 1/16"
Description: SUPT POST MICR .18"DIA FR 1 1/4"
Packaging: Bulk
Material: Nylon, Flame Retardant
Between Board Height: 1.250" (31.75mm) 1 1/4"
Holding Type: Snap Fit
Mounting Hole Diameter: 0.125" (3.18mm) 1/8"
Mounting Panel Thickness: 0.062" (1.57mm) 1/16"
Support Hole Diameter: 0.125" (3.18mm) 1/8"
Support Panel Thickness: 0.062" (1.57mm) 1/16"
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Technische Details MSPM-20-19 Essentra Components
Description: SUPT POST MICR .18"DIA FR 1 1/4", Packaging: Bulk, Material: Nylon, Flame Retardant, Between Board Height: 1.250" (31.75mm) 1 1/4", Holding Type: Snap Fit, Mounting Hole Diameter: 0.125" (3.18mm) 1/8", Mounting Panel Thickness: 0.062" (1.57mm) 1/16", Support Hole Diameter: 0.125" (3.18mm) 1/8", Support Panel Thickness: 0.062" (1.57mm) 1/16".