MT53E1G32D2FW-046 IT:B TR Micron Technology Inc.
Hersteller: Micron Technology Inc.
Description: IC DRAM 32GBIT PAR 200TFBGA
Packaging: Cut Tape (CT)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 1G x 32
DigiKey Programmable: Not Verified
Description: IC DRAM 32GBIT PAR 200TFBGA
Packaging: Cut Tape (CT)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 1G x 32
DigiKey Programmable: Not Verified
auf Bestellung 1526 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 51.30 EUR |
| 10+ | 47.45 EUR |
| 25+ | 45.93 EUR |
| 50+ | 44.79 EUR |
| 100+ | 44.54 EUR |
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Technische Details MT53E1G32D2FW-046 IT:B TR Micron Technology Inc.
Description: IC DRAM 32GBIT PAR 200TFBGA, Packaging: Tape & Reel (TR), Package / Case: 200-TFBGA, Mounting Type: Surface Mount, Memory Size: 32Gbit, Memory Type: Volatile, Operating Temperature: -40°C ~ 95°C (TC), Voltage - Supply: 1.06V ~ 1.17V, Technology: SDRAM - Mobile LPDDR4X, Clock Frequency: 2.133 GHz, Memory Format: DRAM, Supplier Device Package: 200-TFBGA (10x14.5), Write Cycle Time - Word, Page: 18ns, Memory Interface: Parallel, Access Time: 3.5 ns, Memory Organization: 1G x 32, DigiKey Programmable: Not Verified.
Weitere Produktangebote MT53E1G32D2FW-046 IT:B TR nach Preis ab 42.13 EUR bis 56.25 EUR
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auf Bestellung 727 Stücke: Lieferzeit 10-14 Tag (e) |
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MT53E1G32D2FW-046 IT:B TR | Hersteller : Micron Technology Inc. |
Description: IC DRAM 32GBIT PAR 200TFBGA Packaging: Tape & Reel (TR) Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 32Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 95°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Access Time: 3.5 ns Memory Organization: 1G x 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |