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0430450809

0430450809 Molex


PS-43045.pdf Hersteller: Molex
Description: CONN HEADER SMD R/A 8POS 3MM
Features: Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Header
Voltage Rating: 600V
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Surface Mount, Right Angle
Number of Positions: 8
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Locking Ramp
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Brass Alloy
Insulation Color: Black
Pitch - Mating: 0.118" (3.00mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 60.0µin (1.52µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.290" (7.37mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.118" (3.00mm)
auf Bestellung 20200 Stücke:

Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
200+6.69 EUR
1000+ 5.55 EUR
2000+ 5.36 EUR
Mindestbestellmenge: 200
Produktrezensionen
Produktbewertung abgeben

Technische Details 0430450809 Molex

Description: CONN HEADER SMD R/A 8POS 3MM, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Header, Voltage Rating: 600V, Current Rating (Amps): Varies by Wire Gauge, Mounting Type: Surface Mount, Right Angle, Number of Positions: 8, Number of Rows: 2, Style: Board to Cable/Wire, Operating Temperature: -40°C ~ 105°C, Contact Type: Male Pin, Fastening Type: Locking Ramp, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Brass Alloy, Insulation Color: Black, Pitch - Mating: 0.118" (3.00mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 60.0µin (1.52µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Insulation Height: 0.290" (7.37mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled, Row Spacing - Mating: 0.118" (3.00mm).

Weitere Produktangebote 0430450809 nach Preis ab 6.69 EUR bis 9.57 EUR

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis ohne MwSt
0430450809 0430450809 Hersteller : Molex PS-43045.pdf Description: CONN HEADER SMD R/A 8POS 3MM
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Header
Voltage Rating: 600V
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Surface Mount, Right Angle
Number of Positions: 8
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Locking Ramp
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Brass Alloy
Insulation Color: Black
Pitch - Mating: 0.118" (3.00mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 60.0µin (1.52µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.290" (7.37mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.118" (3.00mm)
auf Bestellung 20396 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
3+9.57 EUR
10+ 8.42 EUR
100+ 6.69 EUR
Mindestbestellmenge: 3
0430450809 0430450809 Hersteller : Molex 0430450809_pcb_headers.pdf Conn Wire to Board HDR 8 POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0™ T/R
auf Bestellung 4000 Stücke:
Lieferzeit 14-21 Tag (e)
MX-43045-0809 MX-43045-0809
Produktcode: 104876
Hersteller : Molex 430450809_sd.pdf Steckverbinder, Reihenklemmen > Steckverbindungen Mini-Fit und Micro-Fit
Beschreibung: Kontakte 2x6, Schritt 3mm
Anschlusstyp: Micro-Fit
Montage: Platte
Jack: Steckdose
Zahl der Kontakte: 6
Produkt ist nicht verfügbar
0430450809 Hersteller : Molex 0430450809_pcb_headers.pdf Conn Wire to Board HDR 8 POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0™ T/R
Produkt ist nicht verfügbar