Technische Details 0430450809 Molex
Description: CONN HEADER SMD R/A 8POS 3MM, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Header, Voltage Rating: 600V, Current Rating (Amps): Varies by Wire Gauge, Mounting Type: Surface Mount, Right Angle, Number of Positions: 8, Number of Rows: 2, Style: Board to Cable/Wire, Operating Temperature: -40°C ~ 105°C, Contact Type: Male Pin, Fastening Type: Locking Ramp, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Brass Alloy, Insulation Color: Black, Pitch - Mating: 0.118" (3.00mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 60.0µin (1.52µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Insulation Height: 0.290" (7.37mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled, Row Spacing - Mating: 0.118" (3.00mm).
Weitere Produktangebote 0430450809 nach Preis ab 1.8 EUR bis 6.91 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||
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0430450809 | Molex |
 Conn Wire to Board HDR 8 POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R |
auf Bestellung 20629 Stücke: Lieferzeit 14-21 Tag (e) |
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0430450809 | Molex |
Conn Wire to Board HDR 8 POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R |
auf Bestellung 5600 Stücke: Lieferzeit 14-21 Tag (e) |
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0430450809 | Molex |
Conn Wire to Board HDR 8 POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R |
auf Bestellung 5600 Stücke: Lieferzeit 14-21 Tag (e) |
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0430450809 | Molex |
Conn Wire to Board HDR 8 POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R |
auf Bestellung 2006 Stücke: Lieferzeit 14-21 Tag (e) |
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0430450809 | Molex |
Conn Wire to Board HDR 8 POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R |
auf Bestellung 2006 Stücke: Lieferzeit 14-21 Tag (e) |
|
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 |
0430450809 | Molex |
Description: CONN HEADER SMD R/A 8POS 3MM Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Header Voltage Rating: 600V Current Rating (Amps): Varies by Wire Gauge Mounting Type: Surface Mount, Right Angle Number of Positions: 8 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Alloy Insulation Color: Black Pitch - Mating: 0.118" (3.00mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 60.0µin (1.52µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.290" (7.37mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.118" (3.00mm) |
auf Bestellung 11096 Stücke: Lieferzeit 10-14 Tag (e) |
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0430450809 | Molex |
Description: CONN HEADER SMD R/A 8POS 3MM Part Status: Active Contact Finish - Post: Tin Contact Finish Thickness - Mating: 60.0µin (1.52µm) Contact Finish - Mating: Tin Pitch - Mating: 0.118" (3.00mm) Insulation Color: Black Contact Material: Brass Alloy Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Locking Ramp Contact Type: Male Pin Operating Temperature: -40°C ~ 105°C Style: Board to Cable/Wire Number of Rows: 2 Number of Positions: 8 Mounting Type: Surface Mount, Right Angle Connector Type: Header Features: Solder Retention Packaging: Cut Tape (CT) Row Spacing - Mating: 0.118" (3.00mm) Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Shrouding: Shrouded - 4 Wall Insulation Height: 0.290" (7.37mm) Contact Shape: Square Current Rating (Amps): Varies by Wire Gauge Voltage Rating: 600V |
auf Bestellung 11096 Stücke: Lieferzeit 10-14 Tag (e) |
|
| 0430450809 |
|
Hersteller: Molex
Conn Wire to Board HDR 8 POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R
Conn Wire to Board HDR 8 POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R
auf Bestellung 20629 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 91+ | 1.87 EUR |
| 0430450809 |
|
Hersteller: Molex
Conn Wire to Board HDR 8 POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R
Conn Wire to Board HDR 8 POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R
auf Bestellung 5600 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1400+ | 2.49 EUR |
| 0430450809 |
|
Hersteller: Molex
Conn Wire to Board HDR 8 POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R
Conn Wire to Board HDR 8 POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R
auf Bestellung 5600 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1400+ | 2.49 EUR |
| 0430450809 |
|
Hersteller: Molex
Conn Wire to Board HDR 8 POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R
Conn Wire to Board HDR 8 POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R
auf Bestellung 2006 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 53+ | 3.28 EUR |
| 59+ | 2.83 EUR |
| 100+ | 2.46 EUR |
| 250+ | 2.39 EUR |
| 500+ | 2.31 EUR |
| 1000+ | 2.03 EUR |
| 0430450809 |
|
Hersteller: Molex
Conn Wire to Board HDR 8 POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R
Conn Wire to Board HDR 8 POS 3mm Solder RA Side Entry SMD Micro-Fit 3.0 T/R
auf Bestellung 2006 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 53+ | 3.28 EUR |
| 59+ | 2.74 EUR |
| 100+ | 2.33 EUR |
| 250+ | 2.21 EUR |
| 500+ | 2.07 EUR |
| 1000+ | 1.8 EUR |
| 0430450809 |
|
Hersteller: Molex
Description: CONN HEADER SMD R/A 8POS 3MM
Features: Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Header
Voltage Rating: 600V
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Surface Mount, Right Angle
Number of Positions: 8
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Locking Ramp
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Brass Alloy
Insulation Color: Black
Pitch - Mating: 0.118" (3.00mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 60.0µin (1.52µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.290" (7.37mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.118" (3.00mm)
Description: CONN HEADER SMD R/A 8POS 3MM
Features: Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Header
Voltage Rating: 600V
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Surface Mount, Right Angle
Number of Positions: 8
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Locking Ramp
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Brass Alloy
Insulation Color: Black
Pitch - Mating: 0.118" (3.00mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 60.0µin (1.52µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.290" (7.37mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.118" (3.00mm)
auf Bestellung 11096 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 200+ | 4.75 EUR |
| 400+ | 4.52 EUR |
| 600+ | 4.39 EUR |
| 1000+ | 4.24 EUR |
| 1400+ | 4.13 EUR |
| 2000+ | 4.03 EUR |
| 0430450809 |
|
Hersteller: Molex
Description: CONN HEADER SMD R/A 8POS 3MM
Part Status: Active
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 60.0µin (1.52µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.118" (3.00mm)
Insulation Color: Black
Contact Material: Brass Alloy
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Locking Ramp
Contact Type: Male Pin
Operating Temperature: -40°C ~ 105°C
Style: Board to Cable/Wire
Number of Rows: 2
Number of Positions: 8
Mounting Type: Surface Mount, Right Angle
Connector Type: Header
Features: Solder Retention
Packaging: Cut Tape (CT)
Row Spacing - Mating: 0.118" (3.00mm)
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Shrouding: Shrouded - 4 Wall
Insulation Height: 0.290" (7.37mm)
Contact Shape: Square
Current Rating (Amps): Varies by Wire Gauge
Voltage Rating: 600V
Description: CONN HEADER SMD R/A 8POS 3MM
Part Status: Active
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 60.0µin (1.52µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.118" (3.00mm)
Insulation Color: Black
Contact Material: Brass Alloy
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Locking Ramp
Contact Type: Male Pin
Operating Temperature: -40°C ~ 105°C
Style: Board to Cable/Wire
Number of Rows: 2
Number of Positions: 8
Mounting Type: Surface Mount, Right Angle
Connector Type: Header
Features: Solder Retention
Packaging: Cut Tape (CT)
Row Spacing - Mating: 0.118" (3.00mm)
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Shrouding: Shrouded - 4 Wall
Insulation Height: 0.290" (7.37mm)
Contact Shape: Square
Current Rating (Amps): Varies by Wire Gauge
Voltage Rating: 600V
auf Bestellung 11096 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4+ | 6.91 EUR |
| 10+ | 5.85 EUR |
| 100+ | 4.99 EUR |