Produkte > CHIP QUIK INC. > NC191LT500C

NC191LT500C Chip Quik Inc.

Hersteller: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months

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Technische Details NC191LT500C Chip Quik Inc.

Description: SMOOTH FLOW LOW TEMP SOLDER PAST, Packaging: Bulk, Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4), Type: Solder Paste, Melting Point: 280°F (138°C), Form: Cartridge, 17.64 oz (500g), Mesh Type: 4, Flux Type: No-Clean, Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C), Shelf Life Start: Date of Manufacture, Shelf Life: 6 Months.