NC191SNL50 Chip Quik Inc.
Hersteller: Chip Quik Inc.Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 28 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 22.67 EUR |
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Technische Details NC191SNL50 Chip Quik Inc.
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS, Packaging: Bulk, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Type: Solder Paste, Melting Point: 422 ~ 428°F (217 ~ 220°C), Form: Jar, 1.76 oz (50g), Mesh Type: 4, Process: Lead Free, Flux Type: No-Clean, Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C), Shelf Life Start: Date of Manufacture, Shelf Life: 6 Months.