NC3SWLF.020 0.3OZ Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE MINI POCKET PACK
Part Status: Active
Flux Type: No-Clean
Form: Tube, 0.3 oz (8.51g)
Melting Point: 430°F (221°C)
Type: Wire Solder
Composition: Sn96.5Ag3.5 (96.5/3.5)
Wire Gauge: 24 AWG, 25 SWG
Diameter: 0.020" (0.51mm)
Packaging: Bulk
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Technische Details NC3SWLF.020 0.3OZ Chip Quik Inc.
Description: LF SOLDER WIRE MINI POCKET PACK, Part Status: Active, Flux Type: No-Clean, Form: Tube, 0.3 oz (8.51g), Melting Point: 430°F (221°C), Type: Wire Solder, Composition: Sn96.5Ag3.5 (96.5/3.5), Wire Gauge: 24 AWG, 25 SWG, Diameter: 0.020" (0.51mm), Packaging: Bulk.