NC4SW.020 1LB Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 93.5/5/1.5 LEAD/TIN/
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Pb93.5Sn5Ag1.5 (93.5/5/1.5)
Type: Wire Solder
Melting Point: 565 ~ 574°F (296 ~ 301°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Description: SOLDER WIRE 93.5/5/1.5 LEAD/TIN/
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Pb93.5Sn5Ag1.5 (93.5/5/1.5)
Type: Wire Solder
Melting Point: 565 ~ 574°F (296 ~ 301°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
1+ | 64.68 EUR |
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Technische Details NC4SW.020 1LB Chip Quik Inc.
Description: SOLDER WIRE 93.5/5/1.5 LEAD/TIN/, Packaging: Bulk, Diameter: 0.020" (0.51mm), Wire Gauge: 24 AWG, 25 SWG, Composition: Pb93.5Sn5Ag1.5 (93.5/5/1.5), Type: Wire Solder, Melting Point: 565 ~ 574°F (296 ~ 301°C), Form: Spool, 1 lb (454 g), Process: Leaded, Flux Type: No-Clean, Part Status: Active.