NCSWLF.031 1LB Chip Quik Inc.
Hersteller: Chip Quik Inc.Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
auf Bestellung 16 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 142.14 EUR |
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Technische Details NCSWLF.031 1LB Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI, Packaging: Bulk, Diameter: 0.031" (0.79mm), Wire Gauge: 20 AWG, 21 SWG, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Type: Wire Solder, Melting Point: 422 ~ 428°F (217 ~ 220°C), Form: Spool, 1 lb (454 g), Process: Lead Free, Flux Type: No-Clean.