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ORSPI4-3F1156C Lattice Semiconductor Corporation

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Hersteller: Lattice Semiconductor Corporation
Description: FPGA, 2024 CLBS, 471000 GATES
Part Status: Active
Architecture: MPU, FPGA
Supplier Device Package: 1156-FPBGA (35x35)
Peripherals: LVD
Connectivity: FIFO
Primary Attributes: FPGA - 15K Logic Elements
Core Processor: SPI4
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 250MHz
Package / Case: 1156-BBGA
Packaging: Bulk

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Technische Details ORSPI4-3F1156C Lattice Semiconductor Corporation

Description: FPGA, 2024 CLBS, 471000 GATES, Part Status: Active, Architecture: MPU, FPGA, Supplier Device Package: 1156-FPBGA (35x35), Peripherals: LVD, Connectivity: FIFO, Primary Attributes: FPGA - 15K Logic Elements, Core Processor: SPI4, Operating Temperature: -40°C ~ 125°C (TJ), Speed: 250MHz, Package / Case: 1156-BBGA, Packaging: Bulk.