P05N-030ST-A-G 3M Interconnect Solutions
Hersteller: 3M Interconnect SolutionsConn Board to Board SKT 30 POS 0.5mm Solder ST Top Entry SMD T/R
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Technische Details P05N-030ST-A-G 3M Interconnect Solutions
Description: CONN SOCKET 30POS SMD GOLD, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Socket, Outer Shroud Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 30, Pitch: 0.020" (0.50mm), Height Above Board: 0.093" (2.35mm), Contact Finish Thickness: 8.00µin (0.203µm), Mated Stacking Heights: 3mm, Part Status: Active, Number of Rows: 2.
Weitere Produktangebote P05N-030ST-A-G
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
| P05N-030ST-A-G | Hersteller : 3M Interconnect Solutions |
Conn Board to Board SKT 30 POS 0.5mm Solder ST Top Entry SMD T/R |
Produkt ist nicht verfügbar |
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| P05N-030ST-A-G | Hersteller : 3M |
Description: CONN SOCKET 30POS SMD GOLDFeatures: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Socket, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 30 Pitch: 0.020" (0.50mm) Height Above Board: 0.093" (2.35mm) Contact Finish Thickness: 8.00µin (0.203µm) Mated Stacking Heights: 3mm Part Status: Active Number of Rows: 2 |
Produkt ist nicht verfügbar |
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P05N-030ST-A-G | Hersteller : 3M Electronic Solutions Division |
Board to Board & Mezzanine Connectors 30POS 0.5MM SOLDERST BRD TO BRD SKT |
Produkt ist nicht verfügbar |
