PA-TQFP-BB003-1 Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: TQFP 486480100 PIN BREADBOARD -
Packaging: Bulk
Size / Dimension: 4.000" L x 4.000" W (101.60mm x 101.60mm)
Material: FR4 Epoxy Glass
Number of Positions: 48, 64, 80, 100
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to PGA
Package Accepted: TQFP
Description: TQFP 486480100 PIN BREADBOARD -
Packaging: Bulk
Size / Dimension: 4.000" L x 4.000" W (101.60mm x 101.60mm)
Material: FR4 Epoxy Glass
Number of Positions: 48, 64, 80, 100
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to PGA
Package Accepted: TQFP
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Technische Details PA-TQFP-BB003-1 Chip Quik Inc.
Description: TQFP 486480100 PIN BREADBOARD -, Packaging: Bulk, Size / Dimension: 4.000" L x 4.000" W (101.60mm x 101.60mm), Material: FR4 Epoxy Glass, Number of Positions: 48, 64, 80, 100, Pitch: 0.020" (0.50mm), Board Thickness: 0.063" (1.60mm), Proto Board Type: SMD to PGA, Package Accepted: TQFP.