PA0192-S Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: TSSOP-14-EXP-PAD STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TSSOP
Inner Dimension: 0.197" L x 0.173" W (5.00mm x 4.40mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.433" L x 0.118" W (11.00mm x 3.00mm)
Number of Positions: 14
Description: TSSOP-14-EXP-PAD STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TSSOP
Inner Dimension: 0.197" L x 0.173" W (5.00mm x 4.40mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.433" L x 0.118" W (11.00mm x 3.00mm)
Number of Positions: 14
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Technische Details PA0192-S Chip Quik Inc.
Description: TSSOP-14-EXP-PAD STENCIL, Packaging: Bulk, Material: Stainless Steel, Pitch: 0.026" (0.65mm), Type: TSSOP, Inner Dimension: 0.197" L x 0.173" W (5.00mm x 4.40mm), Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm), Part Status: Active, Thermal Center Pad: 0.433" L x 0.118" W (11.00mm x 3.00mm), Number of Positions: 14.
Weitere Produktangebote PA0192-S
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
PA0192-S | Hersteller : Chip Quik | Sockets & Adapters TSSOP-14-Exp-Pad Stainless Steel Sten |
Produkt ist nicht verfügbar |