PA0209 Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: TSOP-50 II TO DIP-50 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.500" (25.40mm x 63.50mm)
Material: FR4 Epoxy Glass
Number of Positions: 50
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
Description: TSOP-50 II TO DIP-50 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.500" (25.40mm x 63.50mm)
Material: FR4 Epoxy Glass
Number of Positions: 50
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
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Technische Details PA0209 Chip Quik Inc.
Description: TSOP-50 II TO DIP-50 SMT ADAPTER, Packaging: Bulk, Size / Dimension: 1.000" x 2.500" (25.40mm x 63.50mm), Material: FR4 Epoxy Glass, Number of Positions: 50, Pitch: 0.031" (0.80mm), Board Thickness: 0.062" (1.57mm) 1/16", Proto Board Type: SMD to DIP, Package Accepted: TSOP, Part Status: Active.
Weitere Produktangebote PA0209
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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PA0209 | Hersteller : Chip Quik | Sockets & Adapters TSOP-50 (II)toDIP-50 SMT Adapter |
Produkt ist nicht verfügbar |