PR27-23-10.8-0.127 Shiu Li Technology Co., Ltd.
Hersteller: Shiu Li Technology Co., Ltd.
Description: HIGH INSULATED THERMAL CONDUCTIV
Packaging: Bag
Color: Gray
Material: Polyimide
Shape: Rectangular
Thickness: 0.0050" (0.127mm)
Type: Conductive Insulator Pad
Outline: 23.00mm x 10.80mm
Thermal Conductivity: 1.8W/m-K
Backing, Carrier: Polyimide
Part Status: Active
Description: HIGH INSULATED THERMAL CONDUCTIV
Packaging: Bag
Color: Gray
Material: Polyimide
Shape: Rectangular
Thickness: 0.0050" (0.127mm)
Type: Conductive Insulator Pad
Outline: 23.00mm x 10.80mm
Thermal Conductivity: 1.8W/m-K
Backing, Carrier: Polyimide
Part Status: Active
auf Bestellung 29990 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
12+ | 1.48 EUR |
25+ | 1.4 EUR |
50+ | 1.37 EUR |
100+ | 1.35 EUR |
250+ | 1.26 EUR |
500+ | 1.18 EUR |
1000+ | 1.07 EUR |
5000+ | 1.03 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details PR27-23-10.8-0.127 Shiu Li Technology Co., Ltd.
Description: HIGH INSULATED THERMAL CONDUCTIV, Packaging: Bag, Color: Gray, Material: Polyimide, Shape: Rectangular, Thickness: 0.0050" (0.127mm), Type: Conductive Insulator Pad, Outline: 23.00mm x 10.80mm, Thermal Conductivity: 1.8W/m-K, Backing, Carrier: Polyimide, Part Status: Active.