PR27-23-10.8-0.127 Shiu Li Technology Co., Ltd.
Hersteller: Shiu Li Technology Co., Ltd.
Description: HIGH INSULATED THERMAL CONDUCTIV
Part Status: Active
Backing, Carrier: Polyimide
Thermal Conductivity: 1.8W/m-K
Outline: 23.00mm x 10.80mm
Type: Conductive Insulator Pad
Thickness: 0.0050" (0.127mm)
Shape: Rectangular
Material: Polyimide
Color: Gray
Packaging: Bag
| Anzahl | Preis |
|---|---|
| 11+ | 1.65 EUR |
| 13+ | 1.46 EUR |
| 25+ | 1.39 EUR |
| 50+ | 1.34 EUR |
| 100+ | 1.29 EUR |
| 250+ | 1.23 EUR |
| 700+ | 1.16 EUR |
| 1400+ | 1.12 EUR |
| 5600+ | 1.04 EUR |
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Technische Details PR27-23-10.8-0.127 Shiu Li Technology Co., Ltd.
Description: HIGH INSULATED THERMAL CONDUCTIV, Part Status: Active, Backing, Carrier: Polyimide, Thermal Conductivity: 1.8W/m-K, Outline: 23.00mm x 10.80mm, Type: Conductive Insulator Pad, Thickness: 0.0050" (0.127mm), Shape: Rectangular, Material: Polyimide, Color: Gray, Packaging: Bag.