Produkte > BERGQUIST > Q3-0.005-AC-108

Q3-0.005-AC-108 Bergquist


BERGQUIST-SIL-PAD-TSP-Q3000-en_GL.pdf Hersteller: Bergquist
Description: THERM PAD 116.84MMX60.96MM W/ADH
Packaging: Bulk
Color: Black
Material: Elastomer
Shape: Rectangular
Thickness: 0.0050" (0.127mm)
Type: Pad, Sheet
Thermal Resistivity: 0.35°C/W
Usage: Power Module
Outline: 116.84mm x 60.96mm
Thermal Conductivity: 2.0W/m-K
Adhesive: Adhesive - One Side
Backing, Carrier: Fiberglass
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Technische Details Q3-0.005-AC-108 Bergquist

Description: THERM PAD 116.84MMX60.96MM W/ADH, Packaging: Bulk, Color: Black, Material: Elastomer, Shape: Rectangular, Thickness: 0.0050" (0.127mm), Type: Pad, Sheet, Thermal Resistivity: 0.35°C/W, Usage: Power Module, Outline: 116.84mm x 60.96mm, Thermal Conductivity: 2.0W/m-K, Adhesive: Adhesive - One Side, Backing, Carrier: Fiberglass.