Technische Details QFS-016-04.25-L-D-DP Samtec
Description: CONN DIFF ARRAY RCP 32P SMD GOLD, Packaging: Tray, Features: Ground Bus (Plane), Connector Type: Differential Pair Array, Female, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 32, Pitch: 0.025" (0.64mm), Height Above Board: 0.278" (7.06mm), Contact Finish Thickness: 10.0µin (0.25µm), Mated Stacking Heights: 10mm, 11mm, 14mm, Number of Rows: 2.
Weitere Produktangebote QFS-016-04.25-L-D-DP
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
 |
QFS-016-04.25-L-D-DP | Hersteller : Samtec |
 Conn Micro High Speed Socket Strip SKT 32 POS 0.635mm Solder ST SMD Tray |
Produkt ist nicht verfügbar |
|
 |
QFS-016-04.25-L-D-DP | Hersteller : Samtec |
Conn Micro High Speed Socket Strip SKT 32 POS 0.635mm Solder ST SMD Tray |
Produkt ist nicht verfügbar |
|
| QFS-016-04.25-L-D-DP | Hersteller : Samtec Inc. |
Description: CONN DIFF ARRAY RCP 32P SMD GOLD Packaging: Tray Features: Ground Bus (Plane) Connector Type: Differential Pair Array, Female Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 32 Pitch: 0.025" (0.64mm) Height Above Board: 0.278" (7.06mm) Contact Finish Thickness: 10.0µin (0.25µm) Mated Stacking Heights: 10mm, 11mm, 14mm Number of Rows: 2 |
Produkt ist nicht verfügbar |
||
 |
QFS-016-04.25-L-D-DP | Hersteller : Samtec |
Headers & Wire Housings 0.635 mm Q2 High-Speed Rugged Ground Plane Socket Strip |
Produkt ist nicht verfügbar |