Produkte > SAMTEC INC. > QFS-016-04.25-L-D-DP

QFS-016-04.25-L-D-DP Samtec Inc.


Hersteller: Samtec Inc.
Description: CONN DIFF ARRAY RCP 32P SMD GOLD
Features: Ground Bus (Plane)
Packaging: Tray
Connector Type: Differential Pair Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 32
Pitch: 0.025" (0.64mm)
Height Above Board: 0.278" (7.06mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 10mm, 11mm, 14mm
Number of Rows: 2
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Technische Details QFS-016-04.25-L-D-DP Samtec Inc.

Description: CONN DIFF ARRAY RCP 32P SMD GOLD, Features: Ground Bus (Plane), Packaging: Tray, Connector Type: Differential Pair Array, Female, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 32, Pitch: 0.025" (0.64mm), Height Above Board: 0.278" (7.06mm), Contact Finish Thickness: 10.0µin (0.25µm), Mated Stacking Heights: 10mm, 11mm, 14mm, Number of Rows: 2.

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QFS-016-04.25-L-D-DP QFS-016-04.25-L-D-DP Samtec qfs_xxx_xx_xx_d_ra_xxx_x_xx_mkt-3310313.pdf Headers & Wire Housings 0.635 mm Q2 High-Speed Rugged Ground Plane Socket Strip
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
QFS-016-04.25-L-D-DP qfs_xxx_xx_xx_d_ra_xxx_x_xx_mkt-3310313.pdf
QFS-016-04.25-L-D-DP
Hersteller: Samtec
Headers & Wire Housings 0.635 mm Q2 High-Speed Rugged Ground Plane Socket Strip
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH