QMS-032-02-L-D-DP-RA-MG Samtec Inc.
Hersteller: Samtec Inc.
Description: CONN DIFF ARRAY PLG 64P R/A GOLD
Features: Ground Bus (Plane), Mating Guide
Packaging: Tray
Connector Type: Differential Pair Array, Male
Contact Finish: Gold
Mounting Type: Surface Mount, Right Angle; Through Hole
Number of Positions: 64
Pitch: 0.025" (0.64mm)
Height Above Board: 0.320" (8.12mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Number of Rows: 2
Description: CONN DIFF ARRAY PLG 64P R/A GOLD
Features: Ground Bus (Plane), Mating Guide
Packaging: Tray
Connector Type: Differential Pair Array, Male
Contact Finish: Gold
Mounting Type: Surface Mount, Right Angle; Through Hole
Number of Positions: 64
Pitch: 0.025" (0.64mm)
Height Above Board: 0.320" (8.12mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Number of Rows: 2
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Technische Details QMS-032-02-L-D-DP-RA-MG Samtec Inc.
Description: CONN DIFF ARRAY PLG 64P R/A GOLD, Features: Ground Bus (Plane), Mating Guide, Packaging: Tray, Connector Type: Differential Pair Array, Male, Contact Finish: Gold, Mounting Type: Surface Mount, Right Angle; Through Hole, Number of Positions: 64, Pitch: 0.025" (0.64mm), Height Above Board: 0.320" (8.12mm), Contact Finish Thickness: 10.0µin (0.25µm), Number of Rows: 2.
Weitere Produktangebote QMS-032-02-L-D-DP-RA-MG
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
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QMS-032-02-L-D-DP-RA-MG | Hersteller : Samtec |
 Board to Board & Mezzanine Connectors 0.635 mm Q2 High-Speed Rugged Ground Plane Terminal Strip |
Produkt ist nicht verfügbar |