QMS-032-05.75-L-D-DP-RF1 Samtec Inc.
Hersteller: Samtec Inc.
Description: CONN DIFF ARRAY PLG 64P SMD GOLD
Features: Ground Bus (Plane), RF Jacks (2)
Packaging: Tray
Connector Type: Differential Pair Array, Male
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 66 (64 + 2 RF Jacks)
Pitch: 0.025" (0.64mm)
Height Above Board: 0.212" (5.38mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 10mm, 12mm
Number of Rows: 2
Description: CONN DIFF ARRAY PLG 64P SMD GOLD
Features: Ground Bus (Plane), RF Jacks (2)
Packaging: Tray
Connector Type: Differential Pair Array, Male
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 66 (64 + 2 RF Jacks)
Pitch: 0.025" (0.64mm)
Height Above Board: 0.212" (5.38mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 10mm, 12mm
Number of Rows: 2
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Technische Details QMS-032-05.75-L-D-DP-RF1 Samtec Inc.
Description: CONN DIFF ARRAY PLG 64P SMD GOLD, Features: Ground Bus (Plane), RF Jacks (2), Packaging: Tray, Connector Type: Differential Pair Array, Male, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 66 (64 + 2 RF Jacks), Pitch: 0.025" (0.64mm), Height Above Board: 0.212" (5.38mm), Contact Finish Thickness: 10.0µin (0.25µm), Mated Stacking Heights: 10mm, 12mm, Number of Rows: 2.
Weitere Produktangebote QMS-032-05.75-L-D-DP-RF1
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Verfügbarkeit |
Preis |
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QMS-032-05.75-L-D-DP-RF1 | Hersteller : Samtec |
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