QMS-048-06.75-H-D-DP-PC4 Samtec Inc.
Hersteller: Samtec Inc.
Description: 0.635 MM Q2 HIGH-SPEED RUGGED GR
Number of Rows: 2
Mated Stacking Heights: 11mm, 13mm
Contact Finish Thickness: 30.0µin (0.76µm)
Height Above Board: 0.250" (6.35mm)
Pitch: 0.025" (0.64mm)
Number of Positions: 100 (96 + 4 Power)
Mounting Type: Surface Mount, Through Hole
Contact Finish: Gold
Connector Type: Differential Pair Array, Male
Features: Board Guide, Ground Bus (Plane), Power Pins (8)
Packaging: Tray
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Technische Details QMS-048-06.75-H-D-DP-PC4 Samtec Inc.
Description: 0.635 MM Q2 HIGH-SPEED RUGGED GR, Number of Rows: 2, Mated Stacking Heights: 11mm, 13mm, Contact Finish Thickness: 30.0µin (0.76µm), Height Above Board: 0.250" (6.35mm), Pitch: 0.025" (0.64mm), Number of Positions: 100 (96 + 4 Power), Mounting Type: Surface Mount, Through Hole, Contact Finish: Gold, Connector Type: Differential Pair Array, Male, Features: Board Guide, Ground Bus (Plane), Power Pins (8), Packaging: Tray.
