QSE-014-01-H-D-DP-A-K-TR Samtec Inc.
Hersteller: Samtec Inc.Description: CONN DIFF ARRAY RCP 28P SMD GOLD
Packaging: Cut Tape (CT)
Features: Board Guide, Ground Bus (Plane), Pick and Place
Connector Type: Differential Pair Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 28
Pitch: 0.031" (0.80mm)
Height Above Board: 0.128" (3.25mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 5mm, 8mm, 11mm, 14mm, 16mm, 19mm, 25mm
Number of Rows: 2
auf Bestellung 433 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 20.42 EUR |
| 10+ | 18.09 EUR |
| 25+ | 17.39 EUR |
| 50+ | 16.7 EUR |
| 100+ | 15.77 EUR |
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Technische Details QSE-014-01-H-D-DP-A-K-TR Samtec Inc.
Description: CONN DIFF ARRAY RCP 28P SMD GOLD, Packaging: Tape & Reel (TR), Features: Board Guide, Ground Bus (Plane), Pick and Place, Connector Type: Differential Pair Array, Female, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 28, Pitch: 0.031" (0.80mm), Height Above Board: 0.128" (3.25mm), Contact Finish Thickness: 30.0µin (0.76µm), Mated Stacking Heights: 5mm, 8mm, 11mm, 14mm, 16mm, 19mm, 25mm, Number of Rows: 2.
Weitere Produktangebote QSE-014-01-H-D-DP-A-K-TR
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QSE-014-01-H-D-DP-A-K-TR | Hersteller : Samtec Inc. |
Description: CONN DIFF ARRAY RCP 28P SMD GOLD Packaging: Tape & Reel (TR) Features: Board Guide, Ground Bus (Plane), Pick and Place Connector Type: Differential Pair Array, Female Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 28 Pitch: 0.031" (0.80mm) Height Above Board: 0.128" (3.25mm) Contact Finish Thickness: 30.0µin (0.76µm) Mated Stacking Heights: 5mm, 8mm, 11mm, 14mm, 16mm, 19mm, 25mm Number of Rows: 2 |
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