QSH-020-01-C-D-DP-K Samtec Inc.
Hersteller: Samtec Inc.
Description: CONN DIFF ARRAY RCP 40P SMD GOLD
Packaging: Tray
Features: Ground Bus (Plane), Pick and Place
Connector Type: Differential Pair Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Height Above Board: 0.128" (3.25mm)
Contact Finish Thickness: 50.0µin (1.27µm)
Mated Stacking Heights: 5mm, 8mm, 11mm, 14mm, 16mm, 19mm, 25mm
Number of Rows: 2
Description: CONN DIFF ARRAY RCP 40P SMD GOLD
Packaging: Tray
Features: Ground Bus (Plane), Pick and Place
Connector Type: Differential Pair Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Height Above Board: 0.128" (3.25mm)
Contact Finish Thickness: 50.0µin (1.27µm)
Mated Stacking Heights: 5mm, 8mm, 11mm, 14mm, 16mm, 19mm, 25mm
Number of Rows: 2
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Technische Details QSH-020-01-C-D-DP-K Samtec Inc.
Description: CONN DIFF ARRAY RCP 40P SMD GOLD, Packaging: Tray, Features: Ground Bus (Plane), Pick and Place, Connector Type: Differential Pair Array, Female, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 40, Pitch: 0.020" (0.50mm), Height Above Board: 0.128" (3.25mm), Contact Finish Thickness: 50.0µin (1.27µm), Mated Stacking Heights: 5mm, 8mm, 11mm, 14mm, 16mm, 19mm, 25mm, Number of Rows: 2.