Produkte > SAMTEC INC. > QTE-014-04-L-D-DP

QTE-014-04-L-D-DP Samtec Inc.

Hersteller: Samtec Inc.
Description: CONN DIFF ARRAY PLG 28P SMD GOLD
Mated Stacking Heights: 16mm
Contact Finish Thickness: 10.0µin (0.25µm)
Height Above Board: 0.600" (15.24mm)
Pitch: 0.031" (0.80mm)
Number of Positions: 28
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Differential Pair Array, Male
Number of Rows: 2
Features: Ground Bus (Plane)
Packaging: Tray

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Technische Details QTE-014-04-L-D-DP Samtec Inc.

Description: CONN DIFF ARRAY PLG 28P SMD GOLD, Mated Stacking Heights: 16mm, Contact Finish Thickness: 10.0µin (0.25µm), Height Above Board: 0.600" (15.24mm), Pitch: 0.031" (0.80mm), Number of Positions: 28, Mounting Type: Surface Mount, Contact Finish: Gold, Connector Type: Differential Pair Array, Male, Number of Rows: 2, Features: Ground Bus (Plane), Packaging: Tray.