Produkte > SAMTEC INC. > QTE-028-08-L-D-DP

QTE-028-08-L-D-DP Samtec Inc.

Hersteller: Samtec Inc.
Description: CONN DIFF ARRAY PLG 56P SMD GOLD
Number of Rows: 2
Contact Finish Thickness: 10.0µin (0.25µm)
Height Above Board: 1.151" (29.24mm)
Pitch: 0.031" (0.80mm)
Number of Positions: 56
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Differential Pair Array, Male
Features: Ground Bus (Plane)
Packaging: Bulk

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Technische Details QTE-028-08-L-D-DP Samtec Inc.

Description: CONN DIFF ARRAY PLG 56P SMD GOLD, Number of Rows: 2, Contact Finish Thickness: 10.0µin (0.25µm), Height Above Board: 1.151" (29.24mm), Pitch: 0.031" (0.80mm), Number of Positions: 56, Mounting Type: Surface Mount, Contact Finish: Gold, Connector Type: Differential Pair Array, Male, Features: Ground Bus (Plane), Packaging: Bulk.