QUICK 856AE
Hersteller: QUICK
Category: Hot-air stations
Description: Hot air soldering station; digital,with push-buttons; 1200W
Type of device: hot air soldering station
Temperature control: digital; with push-buttons
Station power: 1200W
Hot air temperature range: 100...500°C
Hot air flow range: 6...200l/min
Kind of heating element: ceramic
Dimensions: 250x230x150mm
Soldering equipment features: digital temperature calibration
Applications of soldering equipment: BGA; CHIP; PLCC; QFP; SMD; SOIC
Version: ESD
Anzahl je Verpackung: 1 Stücke
Category: Hot-air stations
Description: Hot air soldering station; digital,with push-buttons; 1200W
Type of device: hot air soldering station
Temperature control: digital; with push-buttons
Station power: 1200W
Hot air temperature range: 100...500°C
Hot air flow range: 6...200l/min
Kind of heating element: ceramic
Dimensions: 250x230x150mm
Soldering equipment features: digital temperature calibration
Applications of soldering equipment: BGA; CHIP; PLCC; QFP; SMD; SOIC
Version: ESD
Anzahl je Verpackung: 1 Stücke
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Technische Details QUICK 856AE QUICK
Category: Hot-air stations, Description: Hot air soldering station; digital,with push-buttons; 1200W, Type of device: hot air soldering station, Temperature control: digital; with push-buttons, Station power: 1200W, Hot air temperature range: 100...500°C, Hot air flow range: 6...200l/min, Kind of heating element: ceramic, Dimensions: 250x230x150mm, Soldering equipment features: digital temperature calibration, Applications of soldering equipment: BGA; CHIP; PLCC; QFP; SMD; SOIC, Version: ESD, Anzahl je Verpackung: 1 Stücke.
Weitere Produktangebote QUICK 856AE
| Foto | Bezeichnung | Hersteller | Beschreibung |
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QUICK 856AE | Hersteller : QUICK |
Category: Hot-air stations Description: Hot air soldering station; digital,with push-buttons; 1200W Type of device: hot air soldering station Temperature control: digital; with push-buttons Station power: 1200W Hot air temperature range: 100...500°C Hot air flow range: 6...200l/min Kind of heating element: ceramic Dimensions: 250x230x150mm Soldering equipment features: digital temperature calibration Applications of soldering equipment: BGA; CHIP; PLCC; QFP; SMD; SOIC Version: ESD |
Produkt ist nicht verfügbar |