R5F56719DGBP#20 Renesas Electronics Corporation
Hersteller: Renesas Electronics CorporationDescription: IC MCU 32BIT 1MB FLASH 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: RXv3
Data Converters: A/D 10x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: I2C, LINbus, QSPI, SCI, SPI, USB
Peripherals: Capacitive Touch, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-TFBGA (4.5x4.5)
Number of I/O: 43
auf Bestellung 385 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 12.41 EUR |
| 10+ | 11.02 EUR |
| 25+ | 10.51 EUR |
| 40+ | 10.26 EUR |
| 80+ | 9.90 EUR |
| 230+ | 9.37 EUR |
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Technische Details R5F56719DGBP#20 Renesas Electronics Corporation
Description: IC MCU 32BIT 1MB FLASH 64TFBGA, Packaging: Tray, Package / Case: 64-TFBGA, Mounting Type: Surface Mount, Speed: 120MHz, Program Memory Size: 1MB (1M x 8), RAM Size: 384K x 8, Operating Temperature: -40°C ~ 105°C (TA), Oscillator Type: Internal, Program Memory Type: FLASH, EEPROM Size: 8K x 8, Core Processor: RXv3, Data Converters: A/D 10x12b, Core Size: 32-Bit Single-Core, Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V, Connectivity: I2C, LINbus, QSPI, SCI, SPI, USB, Peripherals: Capacitive Touch, DMA, LVD, POR, PWM, WDT, Supplier Device Package: 64-TFBGA (4.5x4.5), Number of I/O: 43.