R7F701373AEABG-C#BC1 Renesas Electronics Corporation

Description: IC MCU 32BIT, Packaging: Tray, Qualification: AEC-Q100, Grade: Automotive, Supplier Device Package: 292-FBGA (17x17), Peripherals: DMA, POR, PWM, Temp Sensor, WDT, Connectivity: CANbus, CSI, Ethernet, FIFO, FlexRay, LINbus, SENT, SPI, UART/USART, Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V, Core Size: 32-Bit Dual-Core, Data Converters: A/D 24x12b SAR, Core Processor: RH850G3M, EEPROM Size: 64K x 8, Program Memory Type: FLASH, Oscillator Type: Internal, Operating Temperature: -40°C ~ 150°C, RAM Size: 448K x 8, Program Memory Size: 2MB (2M x 8), Speed: 240MHz, Mounting Type: Surface Mount, Package / Case: 292-FBGA.