R7F701373AEABG-C#BC1 Renesas Electronics Corporation
Hersteller: Renesas Electronics CorporationDescription: IC MCU 32BIT
Packaging: Tray
Package / Case: 292-FBGA
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 448K x 8
Operating Temperature: -40°C ~ 150°C
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: RH850G3M
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, CSI, Ethernet, FIFO, FlexRay, LINbus, SENT, SPI, UART/USART
Peripherals: DMA, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 292-FBGA (17x17)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 667 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 52.36 EUR |
| 10+ | 42.36 EUR |
| 25+ | 39.87 EUR |
| 100+ | 37.13 EUR |
| 250+ | 35.83 EUR |
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Technische Details R7F701373AEABG-C#BC1 Renesas Electronics Corporation
Description: IC MCU 32BIT, Packaging: Tray, Package / Case: 292-FBGA, Mounting Type: Surface Mount, Speed: 240MHz, Program Memory Size: 2MB (2M x 8), RAM Size: 448K x 8, Operating Temperature: -40°C ~ 150°C, Oscillator Type: Internal, Program Memory Type: FLASH, EEPROM Size: 64K x 8, Core Processor: RH850G3M, Data Converters: A/D 24x12b SAR, Core Size: 32-Bit Dual-Core, Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V, Connectivity: CANbus, CSI, Ethernet, FIFO, FlexRay, LINbus, SENT, SPI, UART/USART, Peripherals: DMA, POR, PWM, Temp Sensor, WDT, Supplier Device Package: 292-FBGA (17x17), Grade: Automotive, Qualification: AEC-Q100.
Weitere Produktangebote R7F701373AEABG-C#BC1
| Foto | Bezeichnung | Hersteller | Beschreibung |
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R7F701373AEABG-C#BC1 | Hersteller : Renesas Electronics |
32-bit Microcontrollers - MCU 32BIT MCU RH850/P1X-C |
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