R7F701375EAFP-C#KA2 Renesas Electronics Corporation
Hersteller: Renesas Electronics CorporationDescription: 32BIT MCU RH850/P1M 100LQFP T&R
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 150°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: RH850G3M
Data Converters: A/D 19x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, CSI, FlexRay, LINbus, PSI5, SCI, SENT, UART/USART
Peripherals: DMA, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 100-LFQFP (14x14)
Number of I/O: 50
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Technische Details R7F701375EAFP-C#KA2 Renesas Electronics Corporation
Description: 32BIT MCU RH850/P1M 100LQFP T&R, Packaging: Tape & Reel (TR), Package / Case: 100-LQFP, Mounting Type: Surface Mount, Speed: 160MHz, Program Memory Size: 2MB (2M x 8), RAM Size: 192K x 8, Operating Temperature: -40°C ~ 150°C (TJ), Oscillator Type: Internal, Program Memory Type: FLASH, EEPROM Size: 64K x 8, Core Processor: RH850G3M, Data Converters: A/D 19x12b, Core Size: 32-Bit Dual-Core, Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V, Connectivity: CANbus, CSI, FlexRay, LINbus, PSI5, SCI, SENT, UART/USART, Peripherals: DMA, POR, PWM, Temp Sensor, WDT, Supplier Device Package: 100-LFQFP (14x14), Number of I/O: 50.