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R7F701397AEABG-C#BC1

R7F701397AEABG-C#BC1 Renesas Electronics Corporation


Hersteller: Renesas Electronics Corporation
Description: IC MCU 32BIT 2MB FLASH 156LFBGA
Packaging: Tray
Package / Case: 156-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 448K x 8
Operating Temperature: -40°C ~ 150°C
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: RH850G3M
Data Converters: A/D 16x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals: DMA, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 156-FBGA (10x10)
auf Bestellung 2060 Stücke:

Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+35.9 EUR
10+ 33.1 EUR
25+ 31.62 EUR
80+ 28.27 EUR
230+ 26.97 EUR
440+ 25.66 EUR
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Technische Details R7F701397AEABG-C#BC1 Renesas Electronics Corporation

Description: IC MCU 32BIT 2MB FLASH 156LFBGA, Packaging: Tray, Package / Case: 156-LFBGA, Mounting Type: Surface Mount, Speed: 240MHz, Program Memory Size: 2MB (2M x 8), RAM Size: 448K x 8, Operating Temperature: -40°C ~ 150°C, Oscillator Type: Internal, Program Memory Type: FLASH, EEPROM Size: 64K x 8, Core Processor: RH850G3M, Data Converters: A/D 16x12b, Core Size: 32-Bit Dual-Core, Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V, Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB, Peripherals: DMA, POR, PWM, Temp Sensor, WDT, Supplier Device Package: 156-FBGA (10x10).

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R7F701397AEABG-C#BC1 R7F701397AEABG-C#BC1 Hersteller : Renesas Electronics REN_r01uh0517ej0130_rh850p1x_c_Open_MAH_20171114-3159595.pdf 32-bit Microcontrollers - MCU 32BIT MCU RH850/P1X-C BGA292
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