R7F7017113ABG-C#AC1 Renesas Electronics
auf Bestellung 118 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 53.26 EUR |
| 10+ | 44.11 EUR |
| 25+ | 41.52 EUR |
| 119+ | 37.36 EUR |
| 238+ | 36.89 EUR |
| 2618+ | 36.87 EUR |
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Technische Details R7F7017113ABG-C#AC1 Renesas Electronics
Description: 32BIT MCU, Packaging: Tray, Package / Case: 233-FBGA, Mounting Type: Surface Mount, Speed: 240MHz, Program Memory Size: 8MB (8M x 8), RAM Size: 1.03M x 8, Operating Temperature: -40°C ~ 105°C (TA), Oscillator Type: Internal, Program Memory Type: FLASH, EEPROM Size: 256K x 8, Core Processor: RH850G3KH, Data Converters: A/D 38x10b, 32x12b, Core Size: 32-Bit Dual-Core, Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V, Connectivity: CANbus, CSI, FIFO, FlexRay, I²C, LINbus, SENT, UART/USART, Peripherals: DMA, LVD, PWM, WDT, Supplier Device Package: 233-FBGA (15x15), Part Status: Active, Number of I/O: 174.
Weitere Produktangebote R7F7017113ABG-C#AC1
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
| R7F7017113ABG-C#AC1 | Hersteller : Renesas Electronics America Inc |
 Description: 32BIT MCUPackaging: Tray Package / Case: 233-FBGA Mounting Type: Surface Mount Speed: 240MHz Program Memory Size: 8MB (8M x 8) RAM Size: 1.03M x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256K x 8 Core Processor: RH850G3KH Data Converters: A/D 38x10b, 32x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, CSI, FIFO, FlexRay, I²C, LINbus, SENT, UART/USART Peripherals: DMA, LVD, PWM, WDT Supplier Device Package: 233-FBGA (15x15) Part Status: Active Number of I/O: 174 |
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