R7F702300BEBBB-C#BC6 Renesas Electronics Corporation
Hersteller: Renesas Electronics CorporationDescription: IC MCU 32BIT 16MB FLASH 373BGA
Packaging: Tray
Package / Case: 373-FBGA
Mounting Type: Surface Mount
Speed: 400MHz
Program Memory Size: 16MB (16M x 8)
RAM Size: 3.5M x 8
Operating Temperature: -40°C ~ 150°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 576K x 8
Core Processor: RH850G4MH
Data Converters: A/D 94x12b SAR
Core Size: 32-Bit8
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, CSI, Ethernet, FlexRay, I2C, LINbus, PSI5S, SCI, SENT, SPI, UART/USART
Peripherals: DMA, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 373-FBGA (21x21)
Grade: Automotive
Number of I/O: 221
Qualification: AEC-Q100
auf Bestellung 472 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 87.63 EUR |
| 10+ | 72.59 EUR |
| 25+ | 68.83 EUR |
| 100+ | 67.55 EUR |
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Technische Details R7F702300BEBBB-C#BC6 Renesas Electronics Corporation
Description: IC MCU 32BIT 16MB FLASH 373BGA, Packaging: Tray, Package / Case: 373-FBGA, Mounting Type: Surface Mount, Speed: 400MHz, Program Memory Size: 16MB (16M x 8), RAM Size: 3.5M x 8, Operating Temperature: -40°C ~ 150°C (TJ), Oscillator Type: Internal, Program Memory Type: FLASH, EEPROM Size: 576K x 8, Core Processor: RH850G4MH, Data Converters: A/D 94x12b SAR, Core Size: 32-Bit8, Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V, Connectivity: CANbus, CSI, Ethernet, FlexRay, I2C, LINbus, PSI5S, SCI, SENT, SPI, UART/USART, Peripherals: DMA, POR, PWM, Temp Sensor, WDT, Supplier Device Package: 373-FBGA (21x21), Grade: Automotive, Number of I/O: 221, Qualification: AEC-Q100.
Weitere Produktangebote R7F702300BEBBB-C#BC6 nach Preis ab 84.48 EUR bis 91.33 EUR
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R7F702300BEBBB-C#BC6 | Hersteller : Renesas Electronics |
32-bit Microcontrollers - MCU 32BIT MCU RH850/U2A16 16MB 373BGA +150C |
auf Bestellung 425 Stücke: Lieferzeit 10-14 Tag (e) |
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