R7FA6E10D2CFP#BA0 Renesas Electronics Corporation
Hersteller: Renesas Electronics Corporation
Description: MCU RA6 ARM CM33 200MHZ 512K/256
Number of I/O: 75
Supplier Device Package: 100-LFQFP (14x14)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, Ethernet, I2C, MMC/SD, QSPI, SCI, Serial Sound, SmartCard, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 11x12b SAR; D/A 1x12b
Core Processor: ARM® Cortex®-M33
EEPROM Size: 8K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
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Technische Details R7FA6E10D2CFP#BA0 Renesas Electronics Corporation
Description: MCU RA6 ARM CM33 200MHZ 512K/256, Number of I/O: 75, Supplier Device Package: 100-LFQFP (14x14), Peripherals: DMA, LVD, POR, PWM, WDT, Connectivity: CANbus, Ethernet, I2C, MMC/SD, QSPI, SCI, Serial Sound, SmartCard, SPI, UART/USART, USB, Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V, Core Size: 32-Bit, Data Converters: A/D 11x12b SAR; D/A 1x12b, Core Processor: ARM® Cortex®-M33, EEPROM Size: 8K x 8, Program Memory Type: FLASH, Oscillator Type: Internal, Operating Temperature: -40°C ~ 85°C (TA), RAM Size: 256K x 8, Program Memory Size: 512KB (512K x 8), Speed: 200MHz, Mounting Type: Surface Mount, Package / Case: 100-LQFP, Packaging: Tray.