R7FA6E2BB3CNH#BA0 Renesas Electronics America Inc

Description: MCU:RA, Number of I/O: 16, Part Status: Active, Supplier Device Package: 32-HWQFN (5x5), Peripherals: DMA, LVD, POR, PWM, WDT, Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI, UART/USART, Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V, Core Size: 32-Bit, Data Converters: A/D 5x12b SAR; D/A 1x12b, Core Processor: ARM® Cortex®-M33, EEPROM Size: 4K x 8, Program Memory Type: FLASH, Oscillator Type: Internal, Operating Temperature: -40°C ~ 125°C (TA), RAM Size: 40K x 8, Program Memory Size: 256KB (256K x 8), Speed: 200MHz, Mounting Type: Surface Mount, Package / Case: 32-WFQFN Exposed Pad, Packaging: Tray.