R9A06G064SGBG#BC0 Renesas Electronics America Inc
Hersteller: Renesas Electronics America Inc
Description: SOC R-IN CL3 CC-LINK IE TSN
Packaging: Tray
Package / Case: 356-FBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: RAM
Core Processor: ARM® Cortex®-M4F
Core Size: 32-Bit
Peripherals: DMA, PWM, WDT
Supplier Device Package: 356-FBGA (17x17)
Part Status: Active
Number of I/O: 101
Description: SOC R-IN CL3 CC-LINK IE TSN
Packaging: Tray
Package / Case: 356-FBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: RAM
Core Processor: ARM® Cortex®-M4F
Core Size: 32-Bit
Peripherals: DMA, PWM, WDT
Supplier Device Package: 356-FBGA (17x17)
Part Status: Active
Number of I/O: 101
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Technische Details R9A06G064SGBG#BC0 Renesas Electronics America Inc
Description: SOC R-IN CL3 CC-LINK IE TSN, Packaging: Tray, Package / Case: 356-FBGA, Mounting Type: Surface Mount, Speed: 100MHz, Program Memory Size: 768KB (768K x 8), RAM Size: 512K x 8, Operating Temperature: -40°C ~ 85°C (TA), Oscillator Type: External, Internal, Program Memory Type: RAM, Core Processor: ARM® Cortex®-M4F, Core Size: 32-Bit, Peripherals: DMA, PWM, WDT, Supplier Device Package: 356-FBGA (17x17), Part Status: Active, Number of I/O: 101.
Weitere Produktangebote R9A06G064SGBG#BC0
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
| R9A06G064SGBG#BC0 | Hersteller : Renesas Electronics |
 ARM Microcontrollers - MCU SOC R-IN CL3 CC-Link IE TSN |
Produkt ist nicht verfügbar |