R9A07G054L28GBG#AC0 Renesas Electronics Corporation


rzv2l-group-datasheet
Hersteller: Renesas Electronics Corporation
Description: IC MPU RZ 200MHZ/1.2GHZ 551BGA
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 200MHz, 1.2GHz
Mounting Type: Surface Mount
Package / Case: 551-LFBGA
Packaging: Tray
Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI
Graphics Acceleration: Yes
RAM Controllers: DDR3L, DDR4
Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 3 Core, 64-Bit
USB: USB 2.0 (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 551-LFBGA (21x21)
Voltage - I/O: 1.8V, 3.3V
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART
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Technische Details R9A07G054L28GBG#AC0 Renesas Electronics Corporation

Description: IC MPU RZ 200MHZ/1.2GHZ 551BGA, Operating Temperature: -40°C ~ 85°C (TA), Speed: 200MHz, 1.2GHz, Mounting Type: Surface Mount, Package / Case: 551-LFBGA, Packaging: Tray, Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI, Graphics Acceleration: Yes, RAM Controllers: DDR3L, DDR4, Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD, Number of Cores/Bus Width: 3 Core, 64-Bit, USB: USB 2.0 (2), Ethernet: 10/100/1000Mbps (2), Supplier Device Package: 551-LFBGA (21x21), Voltage - I/O: 1.8V, 3.3V, Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33, Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART.