R9A09G047E58GBG#BC1 Renesas Electronics Corporation

Description: SOC:ASIC, Packaging: Tray, Package / Case: 625-FBGA, FCBGA, Mounting Type: Surface Mount, Speed: 1.8GHz, Operating Temperature: -40°C ~ 125°C (TJ), Core Processor: ARM® Cortex®-A55, Voltage - I/O: 1.2V, 1.8V, 3.3V, Supplier Device Package: 625-FCBGA (21x21), Ethernet: 10/100/1000Mbps (2), USB: USB 2.0 (2), USB 3.2 (1), Number of Cores/Bus Width: 4 Core, 64-Bit, Co-Processors/DSP: ARM® Cortex®-M33, RAM Controllers: LPDDR4, LPDDR4x, Graphics Acceleration: No, Display & Interface Controllers: LCD, LVDS, MIPI-CSI2, Security Features: AES, ECC, SHA, TRNG, Additional Interfaces: CANbus, DMA, Ethernet, GPIO, I2C, I2S, MMC/SD/SDIO, SCI.