RASW.020 .4OZ Chip Quik Inc.
Hersteller: Chip Quik Inc.Description: SOLDER WIRE POCKET PACK 63/37 TI
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Tube, 0.4 oz (11.34g)
Process: Leaded
Flux Type: Rosin Activated (RA)
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 8.99 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details RASW.020 .4OZ Chip Quik Inc.
Description: SOLDER WIRE POCKET PACK 63/37 TI, Packaging: Bulk, Diameter: 0.020" (0.51mm), Wire Gauge: 24 AWG, 25 SWG, Composition: Sn63Pb37 (63/37), Type: Wire Solder, Melting Point: 361°F (183°C), Form: Tube, 0.4 oz (11.34g), Process: Leaded, Flux Type: Rosin Activated (RA).