RASW.031 .7OZ Chip Quik Inc.
Hersteller: Chip Quik Inc.Description: SOLDER WIRE POCKET PACK 63/37 TI
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 21 AWG, 20 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Tube, 0.7 oz (19.85g)
Process: Leaded
Flux Type: Rosin Activated (RA)
auf Bestellung 31 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 3+ | 7.15 EUR |
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Technische Details RASW.031 .7OZ Chip Quik Inc.
Description: SOLDER WIRE POCKET PACK 63/37 TI, Packaging: Bulk, Diameter: 0.031" (0.79mm), Wire Gauge: 21 AWG, 20 SWG, Composition: Sn63Pb37 (63/37), Type: Wire Solder, Melting Point: 361°F (183°C), Form: Tube, 0.7 oz (19.85g), Process: Leaded, Flux Type: Rosin Activated (RA).