RASWLF.015 8OZ Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Shelf Life: 60 Months
Shelf Life Start: Date of Manufacture
Flux Type: Rosin Activated (RA)
Process: Lead Free
Form: Spool, 8 oz (227g), 1/2 lb
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Type: Wire Solder
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Wire Gauge: 27 AWG, 28 SWG
Diameter: 0.015" (0.38mm)
Packaging: Bulk
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Technische Details RASWLF.015 8OZ Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI, Shelf Life: 60 Months, Shelf Life Start: Date of Manufacture, Flux Type: Rosin Activated (RA), Process: Lead Free, Form: Spool, 8 oz (227g), 1/2 lb, Melting Point: 422 ~ 428°F (217 ~ 220°C), Type: Wire Solder, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Wire Gauge: 27 AWG, 28 SWG, Diameter: 0.015" (0.38mm), Packaging: Bulk.