RFN10B3STL

RFN10B3STL Rohm Semiconductor


RFN10B3S.pdf Hersteller: Rohm Semiconductor
Description: DIODE GEN PURP 350V 10A CPD
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Current - Average Rectified (Io): 10A
Supplier Device Package: CPD
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 350 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 10 A
Current - Reverse Leakage @ Vr: 10 µA @ 350 V
Produkt ist nicht verfügbar

Produktrezensionen
Produktbewertung abgeben

Technische Details RFN10B3STL Rohm Semiconductor

Description: DIODE GEN PURP 350V 10A CPD, Packaging: Tape & Reel (TR), Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63, Mounting Type: Surface Mount, Speed: Fast Recovery =< 500ns, > 200mA (Io), Reverse Recovery Time (trr): 30 ns, Technology: Standard, Current - Average Rectified (Io): 10A, Supplier Device Package: CPD, Operating Temperature - Junction: 150°C (Max), Voltage - DC Reverse (Vr) (Max): 350 V, Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 10 A, Current - Reverse Leakage @ Vr: 10 µA @ 350 V.

Weitere Produktangebote RFN10B3STL

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis ohne MwSt
RFN10B3STL RFN10B3STL Hersteller : Rohm Semiconductor RFN10B3S.pdf Description: DIODE GEN PURP 350V 10A CPD
Packaging: Cut Tape (CT)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Current - Average Rectified (Io): 10A
Supplier Device Package: CPD
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 350 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 10 A
Current - Reverse Leakage @ Vr: 10 µA @ 350 V
Produkt ist nicht verfügbar