RP605Z363B-E2-F

RP605Z363B-E2-F Nisshinbo Micro Devices Inc.


rp605-ea.pdf Hersteller: Nisshinbo Micro Devices Inc.
Description: 300MA ULTRA-LOW POWER BUCK BOOST
Packaging: Cut Tape (CT)
Package / Case: 20-XFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Applications: Battery Management, Power Supplies
Current - Supply: 300nA
Supplier Device Package: 20-WLCSP-P3 (2.32x1.71)
auf Bestellung 3797 Stücke:

Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+3.66 EUR
10+2.71 EUR
25+2.47 EUR
100+2.21 EUR
250+2.08 EUR
500+2.01 EUR
1000+1.94 EUR
2500+1.88 EUR
Mindestbestellmenge: 5
Im Einkaufswagen  Stück im Wert von  UAH
Produktrezensionen
Produktbewertung abgeben

Technische Details RP605Z363B-E2-F Nisshinbo Micro Devices Inc.

Description: 300MA ULTRA-LOW POWER BUCK BOOST, Packaging: Tape & Reel (TR), Package / Case: 20-XFBGA, WLCSP, Mounting Type: Surface Mount, Operating Temperature: -40°C ~ 85°C (TA), Voltage - Supply: 1.8V ~ 5.5V, Applications: Battery Management, Power Supplies, Current - Supply: 300nA, Supplier Device Package: 20-WLCSP-P3 (2.32x1.71).

Weitere Produktangebote RP605Z363B-E2-F

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis
RP605Z363B-E2-F RP605Z363B-E2-F Hersteller : Nisshinbo Micro Devices Inc. rp605-ea.pdf Description: 300MA ULTRA-LOW POWER BUCK BOOST
Packaging: Tape & Reel (TR)
Package / Case: 20-XFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Applications: Battery Management, Power Supplies
Current - Supply: 300nA
Supplier Device Package: 20-WLCSP-P3 (2.32x1.71)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH