Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 30X30X30MM L-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.181" (30.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.181" (30.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 8.57°C/W @ 100 LFM
Fin Height: 1.181" (30.00mm)
Material Finish: Blue Anodized

Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 30X30X35MM L-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.181" (30.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.181" (30.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 100 LFM
Fin Height: 1.378" (35.00mm)
Material Finish: Blue Anodized

Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 35X35X10MM L-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 23.98°C/W @ 100 LFM
Fin Height: 0.394" (10.00mm)
Material Finish: Blue Anodized

Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 35X35X15MM L-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 17.72°C/W @ 100 LFM
Fin Height: 0.590" (15.00mm)
Material Finish: Blue Anodized
Part Status: Active

Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 35X35X20MM L-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 13.16°C/W @ 100 LFM
Fin Height: 0.790" (20.00mm)
Material Finish: Blue Anodized

Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 35X35X25MM L-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 10.11°C/W @ 100 LFM
Fin Height: 0.984" (25.00mm)
Material Finish: Blue Anodized

Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 35X35X30MM L-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 7.94°C/W @ 100 LFM
Fin Height: 1.181" (30.00mm)
Material Finish: Blue Anodized

Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 35X35X35MM L-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 6.36°C/W @ 100 LFM
Fin Height: 1.378" (35.00mm)
Material Finish: Blue Anodized

Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 40X40X10MM L-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 21.97°C/W @ 100 LFM
Fin Height: 0.394" (10.00mm)
Material Finish: Blue Anodized

Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 40X40X15MM L-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 16.48°C/W @ 100 LFM
Fin Height: 0.590" (15.00mm)
Material Finish: Blue Anodized

Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 50X50X10MM XCUT CP
Packaging: Bulk
Material: Aluminum
Length: 1.969" (50.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.969" (50.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 9.78°C/W @ 100 LFM
Fin Height: 0.394" (10.00mm)
Material Finish: Blue Anodized
Part Status: Active

Hersteller: TE Connectivity Aerospace, Defense and Marine
Description: CONN HEADER VERT 40POS 2.54MM
Features: Dust Cap, Mounting Flange, Mounting Hardware
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Panel Mount, Through Hole
Number of Positions: 40
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -65°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Threaded
Number of Positions Loaded: All
Termination: Wire Wrap
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Shape: Rectangular
Contact Length - Post: 0.580" (14.73mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Aluminum Alloy
Row Spacing - Mating: 0.100" (2.54mm)

Hersteller: Maker Emporium Ltd
Description: BIT:BUGGY CAR W/MICRO:BIT
Packaging: Bulk
Configuration: Wheeled
Contents: Board(s), Components, Hardware, Screw(s), Servo(s), Wheel(s)
Part Status: Active
Interconnect System: micro:bit
Included MCU/MPU Board(s): BBC micro:bit