S1C17M33F001100-119 Epson Electronics America Inc-Semiconductor Div
Hersteller: Epson Electronics America Inc-Semiconductor Div
Description: IC MCU 16BIT 96KB FLASH 80TQFP14
DigiKey Programmable: Not Verified
Number of I/O: 65
Supplier Device Package: 80-TQFP14 (12x12)
Peripherals: Brown-out Detect/Reset, LCD, POR, PWM, Voltage Detect, WDT
Connectivity: I2C, IrDA, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 6x12b SAR
Core Processor: S1C17
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C
RAM Size: 4K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 17.12MHz
Mounting Type: Surface Mount
Package / Case: 80-TQFP
Packaging: Tray
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Technische Details S1C17M33F001100-119 Epson Electronics America Inc-Semiconductor Div
Description: IC MCU 16BIT 96KB FLASH 80TQFP14, DigiKey Programmable: Not Verified, Number of I/O: 65, Supplier Device Package: 80-TQFP14 (12x12), Peripherals: Brown-out Detect/Reset, LCD, POR, PWM, Voltage Detect, WDT, Connectivity: I2C, IrDA, SPI, UART/USART, Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V, Core Size: 16-Bit, Data Converters: A/D 6x12b SAR, Core Processor: S1C17, Program Memory Type: FLASH, Oscillator Type: External, Internal, Operating Temperature: -40°C ~ 85°C, RAM Size: 4K x 8, Program Memory Size: 96KB (96K x 8), Speed: 17.12MHz, Mounting Type: Surface Mount, Package / Case: 80-TQFP, Packaging: Tray.