S1C17M40F702100 Epson Electronics America Inc-Semiconductor Div
Hersteller: Epson Electronics America Inc-Semiconductor Div
Description: IC MCU 16BIT 48KB FLASH 48TQFP12
Packaging: Tray
DigiKey Programmable: Not Verified
Supplier Device Package: 48-TQFP12 (7x7)
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Connectivity: I2C, IrDA, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12b SAR
Core Processor: S1C17
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C
RAM Size: 2K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 16.8MHz
Mounting Type: Surface Mount
Package / Case: 48-TQFP
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Technische Details S1C17M40F702100 Epson Electronics America Inc-Semiconductor Div
Description: IC MCU 16BIT 48KB FLASH 48TQFP12, Packaging: Tray, DigiKey Programmable: Not Verified, Supplier Device Package: 48-TQFP12 (7x7), Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT, Connectivity: I2C, IrDA, SPI, UART/USART, Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V, Core Size: 16-Bit, Data Converters: A/D 12b SAR, Core Processor: S1C17, EEPROM Size: 256 x 8, Program Memory Type: FLASH, Oscillator Type: External, Internal, Operating Temperature: -40°C ~ 85°C, RAM Size: 2K x 8, Program Memory Size: 48KB (48K x 8), Speed: 16.8MHz, Mounting Type: Surface Mount, Package / Case: 48-TQFP.