SA1000300000G Amphenol Anytek
Hersteller: Amphenol Anytek
Description: SA-7.43- 10P ; CLIP:TIN200U" PI
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 10
Termination: Solder
Housing Material: Thermoplastic, Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Brass
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Description: SA-7.43- 10P ; CLIP:TIN200U" PI
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 10
Termination: Solder
Housing Material: Thermoplastic, Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Brass
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
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Technische Details SA1000300000G Amphenol Anytek
Description: SA-7.43- 10P ; CLIP:TIN200U" PI, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Type: SIP, Operating Temperature: -40°C ~ 105°C, Number of Positions or Pins (Grid): 10, Termination: Solder, Housing Material: Thermoplastic, Polyester, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Brass, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Beryllium Copper.