SAM9X60D5MT-I/4FB-SL3 Microchip Technology
Hersteller: Microchip TechnologyDescription: ARM926 MPU,BGA,IND TEMP,512MBIT
Packaging: Tape & Reel (TR)
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (5)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, LPDDR, LPSDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA
Additional Interfaces: CANbus, DMA, EBI/EMI, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART
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Technische Details SAM9X60D5MT-I/4FB-SL3 Microchip Technology
Description: ARM926 MPU,BGA,IND TEMP,512MBIT, Packaging: Tape & Reel (TR), Package / Case: 233-TFBGA, Mounting Type: Surface Mount, Speed: 600MHz, Operating Temperature: -40°C ~ 85°C (TA), Core Processor: ARM926EJ-S, Voltage - I/O: 1.8V, 3.3V, Supplier Device Package: 233-TFBGA (14x14), Ethernet: 10/100Mbps (2), USB: USB 2.0 (5), Number of Cores/Bus Width: 1 Core, 32-Bit, RAM Controllers: DDR2, LPDDR, LPSDR, SRAM, Graphics Acceleration: Yes, Display & Interface Controllers: LCD, Touchscreen, Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA, Additional Interfaces: CANbus, DMA, EBI/EMI, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART.