SAMA7G54D1G-I/4UB-SL3 Microchip Technology
Hersteller: Microchip Technology
Description: CORTEX-A7 MPU,BGA,IND TEMP,1GB D
Packaging: Tray
Package / Case: 427-TFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.35V
Supplier Device Package: 427-TFBGA (21x18)
Ethernet: 10/100Mbps (1), 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR2, DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512
Additional Interfaces: EBI, I2C, SPI
Description: CORTEX-A7 MPU,BGA,IND TEMP,1GB D
Packaging: Tray
Package / Case: 427-TFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.35V
Supplier Device Package: 427-TFBGA (21x18)
Ethernet: 10/100Mbps (1), 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR2, DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512
Additional Interfaces: EBI, I2C, SPI
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Technische Details SAMA7G54D1G-I/4UB-SL3 Microchip Technology
Description: CORTEX-A7 MPU,BGA,IND TEMP,1GB D, Packaging: Tray, Package / Case: 427-TFBGA, Mounting Type: Surface Mount, Speed: 1GHz, Operating Temperature: -40°C ~ 85°C (TA), Core Processor: ARM® Cortex®-A7, Voltage - I/O: 1.35V, Supplier Device Package: 427-TFBGA (21x18), Ethernet: 10/100Mbps (1), 10/100/1000Mbps (1), USB: USB (3), Number of Cores/Bus Width: 1 Core, 32-Bit, Co-Processors/DSP: Multimedia; NEON™ MPE, RAM Controllers: DDR2, DDR3, DDR3L, LPDDR2, LPDDR3, Graphics Acceleration: No, Security Features: ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512, Additional Interfaces: EBI, I2C, SPI.