SDL-115-TT-11 Samtec Inc.
Hersteller: Samtec Inc.
Description: CONN RCPT 30POS 0.1 TIN PCB
Number of Rows: 2
Row Spacing - Mating: 0.100" (2.54mm)
Insulation Height: 0.132" (3.35mm)
Contact Length - Post: 0.108" (2.75mm)
Part Status: Active
Contact Finish - Post: Tin
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Insulation Color: Black
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 105°C
Style: Board to Board
Number of Positions: 30
Mounting Type: Through Hole
Connector Type: Receptacle
Packaging: Bulk
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Technische Details SDL-115-TT-11 Samtec Inc.
Description: CONN RCPT 30POS 0.1 TIN PCB, Number of Rows: 2, Row Spacing - Mating: 0.100" (2.54mm), Insulation Height: 0.132" (3.35mm), Contact Length - Post: 0.108" (2.75mm), Part Status: Active, Contact Finish - Post: Tin, Contact Finish - Mating: Tin, Pitch - Mating: 0.100" (2.54mm), Insulation Color: Black, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Female Socket, Operating Temperature: -55°C ~ 105°C, Style: Board to Board, Number of Positions: 30, Mounting Type: Through Hole, Connector Type: Receptacle, Packaging: Bulk.
Weitere Produktangebote SDL-115-TT-11
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Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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SDL-115-TT-11 | Hersteller : Samtec |
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